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The Engineered Fluids How to Guide to SLIC
This presentation walks you through all the details of designing building and implementing a SLIC system for cooling Servers, ASIC and GPU devices. It covers materials, formulas, and forms of heat rejection available for use with BitCool and ElectroCool Dielectric Coolants
How are Engineered Fluids' fully synthetic Dielectric Coolants Different from Mineral and White Oils?
Our Chief Scientist & Founder, Dr. David W. Sundin, explains how our 100% synthetic engineered dielectric coolants are radically different from petroleum-based oils in performance, health & safety, and longevity.
The Facts about Corrosive Sulfur in Mineral Oil
If you are considering using Mineral Oil as a dielectric to cool your equipment you should know how the naturally occurring sulfur in mineral oil destroys electronics. Learn more on why this occurs and how to diagnose those random equipment failures.
Thermal Management of Li-on Batteries with AmpCool AC-100
This IEEE published technical paper documents the detailed results achieved by the Engineered Fluids' lab team during extensive testing of AmpCool Dielectric Coolant with a 68Ahr lithium-ion battery cell across a range of charge and discharge cycles
Cooling Transformers more Efficiently with VoltCool
This white paper documents the use of VoltCool Dielectric Coolants in high voltage distribution transformers to reduce operating temperature and increase capacity and reliability in high voltage applications
University of Texas
Impact of Immersion Cooling using ElectroCool EC-100 on the Reliability of Printed Circuit Boards and Electronics
This published research paper documents the results of several months of testing demonstrating the improvement in reliability in PCBs when immersion cooled with EC-100
University of Virginia
Microfluidic Cooling of 3D-ICs with Integrated Cooling Channels using ElectroCool EC-120
This published research paper describes the use of EC-120 to cool stacked integrated circuits with fluid cooling channels designed directly into the 3D-IC die and packaging